The new device (1EDN7550U) is housed in an ultrasmall (1.5 mm x 1.1 mm x 0.39 mm) 6-pin leadless TSNP package. Infineon’s gate-driver ICs with TDIs are key to high-power-density and high-efficiency designs at a lower system cost compared to alternative solutions. The TSNP package (1EDN7550U) occupies a PCB-area five times smaller compared to its SOT-23 family members. With a 3.3 V PWM input signal