Sorry, but Notd.io is not available without javascript New Chips - Notd.io
Collapse Menu

Filter By Location

Filter by Media

...
...

New Chips

Total Subscribers 1

This stream provides information about the latest ICs - microprocessors, SoCs, analog, power regulators and management, network controllers and interface programmable logic and FPGAs, and anything else that contains more than a few transistors. If we miss anything, let us know at seminews@newsplexus.net

This stream provides information about the latest ICs - microprocessors, SoCs, analog, power regulators and management, network controllers and interface programmable logic and FPGAs, and anything else that contains more than a few transistors. If we miss anything, let us know at seminews@newsplexus.net
Stream´s subscription plans

Error while connecting to Transact.io. Please disable your adblock and try again. Reload the page.

newstechnologytype-text

New Chips April 30, 2020

Qualcomm Announces World’s Most Power-Efficient NB2 IoT Chipset
Qualcomm Technologies, Inc. announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm® 212 LTE IoT Modem, the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.
Read More

newstechnologytype-text

New Chips April 30, 2020

AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Adds“Zen 2” Core
New AMD Ryzen 3 3100 & 3300X unlock new levels of performance, delivering twice the multitasking capabilities over previous generations1 with four cores and eight threads. AMD B550 chipset brings the speed and bandwidth of PCIe® 4.0 to mainstream motherboards, delivering incredible performance for Ryzen™ users everywhere
Read More

newstechnologytype-text

New Chips April 30, 2020

Diodes Inc Announces New HDMI 2.1 Active Switch
Diodes Incorporated announced the PI3HDX12221, an HDMI™ 2.1 active switch with linear ReDriver™ that enables manufacturers of TVs, PCs, gaming consoles, and set-top boxes to adopt the latest 12Gbps HDMI standard. The device supports dual inputs with a signal cleaning function that enables extending channel lengths.
Read More

newstechnologytype-text

New Chips April 30, 2020

NXP Announces General Availability of Arm Cortex-M33-based LPC551x/S1x Family
NXP Semiconductors today announced the availability of its LPC551x/S1x microcontroller (MCU) family – further extending its performance-efficient LPC5500 MCU series. The LPC551x/S1x MCU family offers developers low power consumption, embedded security, pin-, software- and peripheral-compatibility to accelerate time-to-market. The LPC551x/S1x family leverages ultra-efficient 40-nm flash technology for cost and performance benefits.
Read More

newstechnologytype-text

New Chips April 30, 2020

ON Semi Announces % New Chips for Industrial Motor Drive Application
ON Semiconductor announced the NXH25C120L2C2, NXH35C120L2C2/2C2E, and NXH50C120L2C2E, which are 25, 35, and 50 Ampere versions of Transfer-Molded Power Integrated Modules (TM-PIM) for 1200 Volt (V) applications. The company also announced the NFAM2012L5B and NFAL5065L4B, expanding its Intelligent Power Module (IPM) portfolio , which includes voltage ratings of 650 V and 1200 V, and current ratings from 10 to 75 A.
Read More

newstechnologytype-text

New Chips April 30, 2020

On Semi Announces New QCS-AX2 Chips for Wi-Fi 6E
ON Semiconductor announced sampling of its new QCS-AX2 chipset family that supports the 6GHz spectrum band based on the enhanced Wi-Fi 6E standard. Designed with a high performance, flexible architecture to maximize usage of the 6GHz band, the new product family is optimized for high-throughput Wi-Fi applications, such as access points, gateways, and mesh networking solutions for dense environments and underserved areas. The QCS-AX2 series is built on an integrated baseband and RF (radio frequency) architecture that supports key Wi-Fi 6E features, such as orthogonal frequency-division multiple access (OFDMA), advanced MU-MIMO (Multi-User, Multi-Input, Multi-Output), and 160MHz channel support for faster speeds, and SmartScan channel selection for maximum band utilization.
Read More

newstechnologytype-text

New Chips April 15, 2020

AMD Announces New 2nd Gen EPYC Processors for Database, Commercial HPC
AMD announced it is extending the 2nd Gen AMD EPYC™ processor family with three new processors that combine the balanced and efficient AMD Infinity architecture with higher speed “Zen 2” cores for optimal performance on database, commercial high-performance computing (HPC) and hyperconverged infrastructure workloads. The three new processors, the AMD EPYC™ 7F32 (8 cores), EPYC™ 7F52 (16 cores) and EPYC™ 7F72 (24 cores), expand 2nd Gen AMD EPYC performance leadership into workloads that can leverage up to 500 MHz of additional base frequency, and large amounts of cache, making AMD EPYC™ the world’s highest per core performance x86 server CPU.
Read More

newstechnologytype-text

New Chips April 15, 2020

Diodes Inc Introduces First  DisplayPort 2.0 Active Switch
Diodes Incorporated announced the industry's first DisplayPort™ 2.0 (UHBR10) compliant 4-lane, 2:1 active switch with multiplexer and ReDriver™, the PI3DPX8121. The device joins the company’s portfolio of DisplayPort switching and signal conditioning solutions engineered to meet the design needs of PCs, monitors, set-top boxes, and other AV equipment.
Read More

newstechnologytype-text

New Chips April 8, 2020

Maxim's Next-Gen SIMO Power Management IC Cuts Real Estate by Half For Wearables
Designers of compact consumer devices can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated. This next-generation SIMO PMIC delivers 3 outputs with just one inductor at 91 percent efficiency, which is 16 percent greater than traditional 4-chip systems.
Read More

newstechnologytype-text

New Chips April 8, 2020

Renesas Introduces New 32-Bit RX72N and RX66N MCUs for Industrial Automation
Renesas announced the RX72N Group and RX66N Group of 32-bit microcontrollers (MCUs), new additions to the RX Family that combines equipment control and networking function on a single chip. Built around the Renesas proprietary RXv3 CPU core, the RX72N features a maximum operating frequency of 240 megahertz (MHz) and two Ethernet channels, and the RX66N features a maximum operating frequency of 120 MHz and one Ethernet channel.
Read More

newstechnologytype-text

New Chips April 8, 2020

Infineon Announces Ultrasmall gate-driver IC with Truly Differential Inputs
Infineon Technologies adds a new cost-effective and compact-size EiceDRIVER™ 1EDN TDI (truly differential inputs) 1-channel gate-driver family that eliminate parasitic inductances that produce ground-shifts that may cause false triggering of the gate-driver IC in low voltages switch-mode power supplies.
Read More

newstechnologytype-text

New Chips April 6, 2020

STMicro Simplifies Power for Smart Devices with Rugged VIPer® Controller
STMicroelectronics’ VIPer222 controller for high-voltage converters up to 8W brings small size, low cost, and versatility to applications such as home appliances, building-automation devices, smart lighting, and smart meters.
Read More

newstechnologytype-text

New Chips April 6, 2020

Renesas 32-Bit MCU Enables Low Cost  Inverter Control in On-Off Switching Motors
Renesas Electronics launched the RX13T Group of 32-bit microcontrollers (MCUs) to enable highly efficient inverter control of compact motors such as fans or pumps in consumer and industrial applications that previously controlled motor operation through on-off switching.
Read More

newstechnologytype-text

New Chips March 26, 2020

STMicro Announces New High-Performance Global-Shutter Image Sensors
STMicroelectronics is enabling the next generation of smart computer-vision applications with new high-speed image sensors that use “global shutter” – the preferred mode for capturing distortion-free images when the scene is moving or when near-infrared illumination is needed.
Read More

newstechnologytype-text

New Chips March 26, 2020

New Ultra-Low Power Bluetooth Audio SoCs From Qualcomm
Qualcomm announced its next generation of ultra-low-power Bluetooth Systems on a Chip (SoCs), designed to deliver outstanding truly wireless support with innovative Qualcomm TrueWireless™ Mirroring technology.
Read More

newstechnologytype-text

New Chips March 24, 2020

STMicro Introduces Standalone VBUS-Powered Controller for 5V USB-C Charging
The STUSB4500L from STMicroelectronics is a small-footprint addition to their USB-C controller IC family designed, and certified for pure 5V sink-only applications. All mandatory features to use the USB-C connector as a 5V universal power plug are integrated, allowing designers to implement USB-C charging solutions quickly and easily without studying the standard or writing code.
Read More

newstechnologytype-text

New Chips March 16, 2020

STMicro Introduces STM32L4  uControllers for Power/Cost-Sensitive Applications
New STM32L4P5 and STM32L4Q5 microcontrollers (MCUs) from STMicroelectronics bring the performance of the Arm® Cortex®-M4 core to cost-sensitive and power-conscious smart connected devices, including utility meters, industrial and medical sensors, fitness trackers, and smart-home products.
Read More

newstechnologytype-text

New Chips March 16, 2020

Renesas Announces Industry’s Highest Performance Wideband mmWave Synthesizer
Highly Integrated 8V97003 Enables Next Generation 5G Radios for Beamforming and MIMO Applications. The flagship 8V97003 device is ideal as a local oscillator (LO) for mmWave and beamforming, or a precision reference clock for a high-speed data converter in numerous applications such as test and measurements, optical networking, and data acquisition.
Read More

newstechnologytype-text

New Chips March 16, 2020

Renesas Expands Wi-SUN FAN Family w/ Wireless Integrated Single-Chip RL78/G1H
Renesas Electronics announced that its RL78/G1H-based sub-gigahertz (sub-GHZ) wireless solution has received certification under the Wireless Smart Ubiquitous Network for Field Area Network profile (Wi-SUN FAN) which is one of the communication standards established by the Wi-SUN Alliance (Note 1). This is an addition to Renesas’ existing high-end dual-chip solution comprising RX651 microcontroller (MCU) and RAA604S00 wireless communications IC, expanding the company’s Wi-SUN FAN-compliant portfolio.
Read More

newstechnologytype-text

New Chips March 16, 2020

Silicon Labs Powers the Future of 5G Small Cells with Power over Ethernet Line
Silicon Labs has introduced a comprehensive Power over Ethernet (PoE) portfolio that reduces the cost and complexity of adding 90 W PoE to power sourcing equipment (PSE) and powered devices (PD). The new 90 W PoE portfolio complies with the IEEE 802.3bt standard, which more than doubles standard PoE power and expands the capabilities of wireless access points and IoT wireless gateways.
Read More

newstechnologytype-text

New Chips March 16, 2020

Micron Samples the Industry’s First uMCP Product With LPDDR5
Micron Technology announced it began sampling the industry’s first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs.
Read More

newstechnologytype-text

New Chips March 16, 2020

Infineon Introduces New Line of Point-of-Load Regulators
Infineon Technologies introduced the IR3887M, IR3888M and IR3889M devices in its new family of integrated-point-of-load voltage regulators featuring a fast constant-on-time (COT) engine. This product family is designed for today’s server, base station and telecom (operating at 85˚C ambient temperature) and storage applications requiring both high efficiency and high density. The IR3887M is the smallest 30 A device on the market. Fusing Infineon’s latest FET generation and enhanced package technology allows for thermal support for 30 A in a small 4 mm x 5 mm footprint.
Read More

newstechnologytype-text

New Chips March 10, 2020

Marvell Delivers First Dual 400GbE PHY with 100G Serial I/Os and MACsec Security
Marvell introduced the industry’s first dual 400GbE (Gigabit Ethernet) PHY transceiver with 100GbE serial electrical I/O capabilities, designed to drive next-generation, secured high-density optical infrastructure. Marvell’s newest dual 400GbE MACsec PHY, the 88X9121P, enables interfacing between the current generation of switch ASICs with the next generation of optics and vice versa by supporting translation between 50G PAM4 and 100G PAM4 based implementations of 400GbE, 200GbE and 100GbE. The 88X9121P is both footprint- and software-compatible with the recently announced 88X7121P, providing a seamless upgrade path that facilitates migration to modules with 100GbE serial I/Os.
Read More

newstechnologytype-text

New Chips March 9, 2020

Stackable DC/DC buck converter from TI delivers up to 160 A of output current
Texas Instruments introduced a new 40-A SWIFT DC/DC buck converter, offering first-of-its-kind stackability of up to four integrated circuits (ICs). The TPS546D24A PMBus buck converter can deliver up to 160 A of output current at an 85°C ambient temperature – four times more current than competing power ICs.
Read More

newstechnologytype-text

New Chips March 6, 2020

Fifth generation OCTEON family supports 4 to 36 Arm v8 cores coupled with comprehensive set of hardware accelerators for networking, security, and wireless infrastructure applications
Read More

newstechnologytype-text

New Chips March 6, 2020

Marvell Launches Next Gen OCTEON Fusion Wireless Infrastructure Processor Family
Built on the OCTEON TX2 platform and optimized for 5G, OCTEON Fusion is a family of solutions for base station applications
Read More

newstechnologytype-text

New Chips March 6, 2020

Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors
Fifth generation OCTEON family supports 4 to 36 Arm v8 cores coupled with comprehensive set of hardware accelerators for networking, security, and wireless infrastructure applications
Read More

newstechnologytype-text

New Chips March 6, 2020

Toshiba Adds New Low Power Consumption Brushed DC Motor Driver IC
The new IC can drive brushed DC motors with a wide range of power supply, from 4.5V to 44V. The numerous applications it supports include mobile devices and devices with 5V USB power supply, and industrial devices, home appliances, printers, and banking terminals that require a high power drive of up to 3.5A[1].
Read More

newstechnologytype-text

New Chips March 6, 2020

STMicroelectronics Announces New class D Audio Amplifier IC
STMicro announced the new FDA901 class-D audio amplifier IC, with a semiconductor design that incorporates the world-class audio design expertise of Alps Alpine Co., Ltd., a major Japanese manufacturer of car audio equipment and information communication equipment. The new chip aims to contribute to the creation of multi-function, high-fidelity car audio systems that fuse the high efficiency of class-D amplifiers with the high-quality sound of ST’s class-AB amplifiers.
Read More

newstechnologytype-text

New Chips March 6, 2020

Allegro Introduces First Standalone Coreless Current Sensor for xEV Inverter
Allegro’s new ultra-compact TSSOP8 package delivers precise current measurements for applications >200A without a magnetic concentrator core or shield
Read More

newstechnologytype-text

New Chips March 6, 2020

Cypress Introduces Sixth Generation USB-C Controllers for PCs and Notebooks
New EZ-PD™ CCG6DF and CCG6SF Dual-port and Single-port Solutions Deliver USB-C Performance, Power Delivery, and Efficiency at Lower Cost
Read More

newstechnologytype-text

New Chips March 3, 2020

NXP Releases Wireless Microcontrollers for Thread and Zigbee with Built-in NFC
NXP Semiconductors announced the new JN5189 and JN5188 IEEE 802.15.4 wireless microcontrollers (MCUs) that deliver ultra-low power connected intelligence for Zigbee 3.0 and Thread applications. As the latest members of NXP’s JN series of devices, the JN5189 and JN5188 are NXP’s first to provide an integrated NFC NTAG while supporting a wide operating temperature range (-40 ℃ to +125 ℃). They also include MCU peripherals making them ideal for smart home, building automation, sensor network, smart lighting and numerous other battery-powered applications.
Read More

newstechnologytype-text

New Chips March 3, 2020

ON Semi Announces New USB-C™ PD 3.0 Controllers
ON Semiconductor has announced a pair of novel devices that are fully compliant with the USB-C PD 3.0 standard. The FAN6390 adaptive charging controller brings ease of integration of the USB-C PD 3.0 programmable power supply (PPS) standard into systems while the NCP12601 is a highly integrated multi-mode flyback controller for rugged, high-performance, offline power supplies such as adapters.
Read More

newstechnologytype-text

New Chips March 3, 2020

TI Introduces 1st Grade 0 Digital Isolator, Supports HiTemp Auto Applications
Texas Instruments introduced the industry’s first digital isolator that is qualified to the Grade 0 ambient operating temperature specification of the Automotive Electronics Council (AEC)-Q100 standard.
Read More

newstechnologytype-text

New Chips February 25, 2020

Marvell Launches Industry’s Lowest Power Automotive Ethernet PHY
Marvell’s second generation 100BASE-T1 exceeds automotive electromagnetic interference requirements with low-power dissipation and previous generation pin compatibility.
Read More

newstechnologytype-text

New Chips February 25, 2020

Maxim Introduces Smallest LiDAR IC with 2x Higher Bandwidth
Compared to the closest competitive solution, the MAX40026 high-speed comparator and the MAX40660/MAX40661 high-bandwidth transimpedance amplifiers enable 10mph (15km/h) faster autonomous driving at highway speeds by providing more than 2x higher bandwidth and accommodating 32 additional channels (128 vs. 96) to a LiDAR module within the same module size.
Read More

newstechnologytype-text

New Chips February 25, 2020

STMicroelectronics Boosts Performance, Enhances STM32 Ecosystem
STMicroelectronics is expanding its STM32MP1 microprocessor (MPU) offering with the addition of new authorized partners, new software functionalities, and a significant performance bump by increasing the clock speed to 800MHz, maintaining software and pin-to-pin compatibility with the 650MHz devices.
Read More

newstechnologytype-text

New Chips February 25, 2020

STMicro New Integrated Wireless-Charging IC Maximizes Power Transfer, Efficiency
STMicroelectronics’ STWLC68 product family provides the best solution for wireless-charging applications with industry-leading efficiency, highest power transfer, and safety, which can operate as both a high-power receiver and a transmitter enabling rapid power transfer and power sharing with FOD (Foreign Object Detection) and other important ST-proprietary safety IPs.
Read More

newstechnologytype-text

New Chips February 25, 2020

New Diodes Inc 6A Sync Buck Converter Targets Point Of Load Applications
Diodes Incorporated introduced the AP62600 synchronous DC-DC buck converter for point-of-load (POL) conversion in applications such as TVs, monitors, white goods, home appliances, consumer electronics, and large-scale integrated circuits.
Read More

newstechnologytype-text

New Chips February 25, 2020

Diodes Inc ReDrivers Signal Quality of High-Speed USB 3.2, 10Gbps Interfaces
Diodes Incorporated introduced a series of USB ReDrivers for the industrial, embedded, and consumer market segments. The PI3EQX1004E and PI3EQX1002E are USB 3.2 compliant, 5Gbps to 10Gbps, 2-Port/1-Port, linear ReDrivers.
Read More

newstechnologytype-text

New Chips February 25, 2020

NXP Announces Far-Field Offline Voice Control Solution, based on the i.MX RT106L
NXP Semiconductorsannounced availability of its voice solution, SLN-LOCAL-IOT, a fully integrated development platform for offline voice control. The solution consists of a full hardware module design and associated software required to implement far-field voice control with a customizable wake word and local commands. The solution is based on the i.MX RT106L crossover microcontroller (MCU), which addresses the market demand for embedded voice control in a broad range of smart home, commercial and industrial markets.
Read More

newstechnologytype-text

New Chips February 25, 2020

NXP Announces Availability of i.MX RT600 Crossover Family of Microcontrollers
NXP Semiconductors announced market availability of the i.MX RT600 crossover microcontroller (MCU) family, for ultra-low power, secure edge applications including audio, voice and machine learning.
Read More

newstechnologytype-text

New Chips February 19, 2020

Qualcomm Introduces Third-Generation 5G Modem-RF System
Qualcomm® Snapdragon™ X60 5G Modem-RF System is World’s First with a 5nm 5G Baseband and First to Aggregate 5G mmWave and Sub-6 Bands, Providing Unprecedented Spectrum Flexibility for Global Operators and Enhanced Performance for Users.
Read More

newstechnologytype-text

New Chips February 19, 2020

Broadcom Announces World’s First Wi-Fi 6E Chip for Mobile Devices
Broadcom announced the world’s first Wi-Fi 6E client device, the BCM4389. Wi-Fi 6E extends the Wi-Fi 6 standard to support the soon-to-be-operational 6 GHz band with wider 160 MHz channel bandwidths that double Wi-Fi speeds and cut latency in half compared to Wi-Fi 5. The BCM4389 delivers over 2 Gbps of real-world speeds and up to five times better battery utilization, making it an ideal solution for flagship smartphones and future AR/VR devices.
Read More

newstechnologytype-text

New Chips February 19, 2020

New Silicon Labs SoCs Enable Eco-Friendly Zigbee Green Power IoT Devices
Silicon Labs Expands Zigbee® Portfolio with Series 2 SoCs Optimized for Ultra-Low-Power Applications. The new family of secure, ultra-low-power Zigbee® system-on-chip (SoC) devices are designed for eco-friendly IoT products deployed in mesh networks. The EFR32MG22 (MG22) family expands Silicon Labs' Zigbee portfolio by delivering the smallest, lowest power SoCs, powered by coin cell batteries or energy-harvesting sources. Target applications include smart home sensors, lighting controls, and building and industrial automation.
Read More

newstechnologytype-text

New Chips February 19, 2020

TI Introduces New 36V, 4A Power Module, 30% Smaller
TI offers high efficiency and low thermal resistance for industrial applications with a new power module in a QFN package
Read More

newstechnologytype-text

New Chips February 19, 2020

TI's new temperature sensors offer 50% higher accuracy, are industry's smallest
The new sensors have higher sensitivity and single point calibration
Read More

newstechnologytype-text

New Chips February 12, 2020

ROHM Introduces 1st Intelligent Power Devices For Standalone System Protection
ROHM recently announced the availability of the BV2Hx045EFU-C, a family of high voltage (41V) dual channel output high side switch (Intelligent Power Devices, IPD) optimized for automotive ECUs in transmission control, engine control, and other vehicle systems. IPDs are semiconductor devices that protect electronic circuits from breakdown (i.e. due to overcurrent during abnormalities). Unlike conventional fuses, IPD as semiconductor fuses can protect circuits without degrading or breaking down, making it possible to achieve maintenance-free systems.
Read More

newstechnologytype-text

New Chips February 12, 2020

ST Launches Highly Integrated and Flexible Synchronous DC/DC Converters
STMicroelectronics’ L6983 38V/3A synchronous DC/DC converters maintain high efficiency at all loads with a maximum value of 95% and are highly integrated with synchronous MOSFETs on-chip to save external components and simplify design.
Read More

newstechnologytype-text

New Chips February 12, 2020

New STSPIN32 BLDC Drivers from STMicroelectronics Target Hi-Voltage Applications
STMicroelectronics has introduced four new devices in the STSPIN32F0 motor-control system-in-package family, which simplify the design of mains-powered home appliances and industrial equipment including corded power tools, drives, pumps, fans, and compressors.
Read More