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This stream provides information about the latest ICs - microprocessors, SoCs, analog, power regulators and management, network controllers and interface programmable logic and FPGAs, and anything else that contains more than a few transistors. If we miss anything, let us know at seminews@newsplexus.net

This stream provides information about the latest ICs - microprocessors, SoCs, analog, power regulators and management, network controllers and interface programmable logic and FPGAs, and anything else that contains more than a few transistors. If we miss anything, let us know at seminews@newsplexus.net
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New Chips February 19, 2020

Qualcomm Introduces Third-Generation 5G Modem-RF System
Qualcomm® Snapdragon™ X60 5G Modem-RF System is World’s First with a 5nm 5G Baseband and First to Aggregate 5G mmWave and Sub-6 Bands, Providing Unprecedented Spectrum Flexibility for Global Operators and Enhanced Performance for Users.
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New Chips February 19, 2020

Broadcom Announces World’s First Wi-Fi 6E Chip for Mobile Devices
Broadcom announced the world’s first Wi-Fi 6E client device, the BCM4389. Wi-Fi 6E extends the Wi-Fi 6 standard to support the soon-to-be-operational 6 GHz band with wider 160 MHz channel bandwidths that double Wi-Fi speeds and cut latency in half compared to Wi-Fi 5. The BCM4389 delivers over 2 Gbps of real-world speeds and up to five times better battery utilization, making it an ideal solution for flagship smartphones and future AR/VR devices.
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New Chips February 19, 2020

New Silicon Labs SoCs Enable Eco-Friendly Zigbee Green Power IoT Devices
Silicon Labs Expands Zigbee® Portfolio with Series 2 SoCs Optimized for Ultra-Low-Power Applications. The new family of secure, ultra-low-power Zigbee® system-on-chip (SoC) devices are designed for eco-friendly IoT products deployed in mesh networks. The EFR32MG22 (MG22) family expands Silicon Labs' Zigbee portfolio by delivering the smallest, lowest power SoCs, powered by coin cell batteries or energy-harvesting sources. Target applications include smart home sensors, lighting controls, and building and industrial automation.
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New Chips February 19, 2020

TI Introduces New 36V, 4A Power Module, 30% Smaller
TI offers high efficiency and low thermal resistance for industrial applications with a new power module in a QFN package
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New Chips February 19, 2020

TI's new temperature sensors offer 50% higher accuracy, are industry's smallest
The new sensors have higher sensitivity and single point calibration
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New Chips February 12, 2020

ROHM Introduces 1st Intelligent Power Devices For Standalone System Protection
ROHM recently announced the availability of the BV2Hx045EFU-C, a family of high voltage (41V) dual channel output high side switch (Intelligent Power Devices, IPD) optimized for automotive ECUs in transmission control, engine control, and other vehicle systems. IPDs are semiconductor devices that protect electronic circuits from breakdown (i.e. due to overcurrent during abnormalities). Unlike conventional fuses, IPD as semiconductor fuses can protect circuits without degrading or breaking down, making it possible to achieve maintenance-free systems.
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New Chips February 12, 2020

ST Launches Highly Integrated and Flexible Synchronous DC/DC Converters
STMicroelectronics’ L6983 38V/3A synchronous DC/DC converters maintain high efficiency at all loads with a maximum value of 95% and are highly integrated with synchronous MOSFETs on-chip to save external components and simplify design.
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New Chips February 12, 2020

New STSPIN32 BLDC Drivers from STMicroelectronics Target Hi-Voltage Applications
STMicroelectronics has introduced four new devices in the STSPIN32F0 motor-control system-in-package family, which simplify the design of mains-powered home appliances and industrial equipment including corded power tools, drives, pumps, fans, and compressors.
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New Chips February 12, 2020

PIC18-Q43 Microcontroller from Microchip Adds Peripherals
Microchip’s PIC18-Q43 family combines more Core Independent Peripherals and an extensive development tool ecosystem for improved designs in real-time control and connected applications
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New Chips February 12, 2020

TI Announces New 500mw DC/DC Converter IC With Integrated Transformer
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply
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New Chips February 5, 2020

Marvell Announces Dual 400GbE MACsec PHY with Class C PTP Timestamping
Marvell announced its dual 400GbE (Gigabit Ethernet) MACsec PHY transceiver with 256-bit encryption and Class C compliant precision time protocol (PTP) timestamping, bringing advanced performance, security and transfer speeds for next-generation networking infrastructure. Hardware-based point-to-point encryption encompassing Ethernet speeds up to 400G is being deployed in cloud, carrier and enterprise networks to address the market demand for enhanced data security.
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New Chips February 5, 2020

STMicro Announces New Cortex-M7 STM32H7 microcontrollers
STMicroelectronics’ latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm® Cortex®-M7 core performance, high memory density, and power savings for future generations of smart objects. Keeping power consumption low, and starting from economical 64-pin QFP packages, the new MCUs boost integration and real-time performance to handle advanced functionalities like rich user interfaces, natural language interaction, RF mesh networking, and Artificial intelligence (AI).
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New Chips February 5, 2020

ON Semiconductor Launches Automotive LED Drivers and Controllers
ON Semiconductor has launched a new family of four devices that facilitate the high levels of performance and innovative functionality that vehicle manufacturers and consumers now expect from automotive exterior and interior lighting. Aimed specifically at low power solid state lighting, the new family comprises two LED drivers (NCV7683 and NCV7685) and two current controllers (NCV7691 and NCV7692).
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New Chips January 31, 2020

ROHM’s New Efficient Power Management IC Optimized for NXP i.MX 8M
ROHM announced the availability of a highly integrated and efficient power management IC (PMIC), BD71850MWV, optimized for NXP® Semiconductors’ i.MX 8M Nano family of application processors, which features exceptional computing, and audio performance.
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New Chips January 31, 2020

Renesas  Introduces Rad-Hardened 1-Chip Sync Buck LDO Regulator for Satellite
Renesas Electronics announced the industry’s first single-chip synchronous buck and low dropout (LDO) regulator targeting low-power FPGAs, DDR memory and other digital loads for spaceflight payload applications. The ISL70005SEH is the only point-of-load (POL) power solution that reduces size, weight, and power (SWaP) by integrating a synch buck and LDO in one monolithic IC. The device enables satellite manufacturers to reduce bill of materials (BOM) and power supply footprint for their medium Earth orbit (MEO) and geosynchronous Earth orbit (GEO) long duration mission profiles.
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New Chips January 31, 2020

Diodes Inc 2nd Gen USB PD Controller Enables Low Standby Power for Quick Charger
Diodes Incorporated announced the availability of the AP43771 USB Type-C® power delivery (PD) controller, featuring an embedded microcontroller with one-time programmable memory. When combined with Diodes Incorporated's complementary technology, the AP43771 forms the basis for offline chargers, delivering between 18W and 33W while supporting Quick Charge™ with extremely low standby power consumption.
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New Chips January 31, 2020

Automotive-Compliant, Real-Time Clocks from Diodes Inc Offer Low-Standby Current
Diodes Incorporated announced that automotive-compliant versions of its popular, low-power, real-time clock (RTC) solutions, PT7C4363BQ and PT7C4563BQ (with an adjustable timer), are now available. Their wide temperature range makes them suitable for automotive applications, including infotainment systems, dashboard displays, and telematics boxes (T-Box).
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New Chips January 31, 2020

NXP Delivers New Bluetooth Microcontroller Intelligence with NFC Peripheral
NXP Semiconductors today announced the availability of its QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible options for 802.15.4, Multiprotocol RF, and optional NFC technology.
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New Chips January 23, 2020

Diodes Inc  Announces Low Power 3.0/SATA3 Combo ReDriver
Diodes Incorporated today announced PI3EQX12904A PCIe 3.0/SATA3 combo ReDriver with linear equalization that supports speeds up to 8Gbps. The PI3EQX12904A provides laptop, notebook, industrial PC, and embedded system developers with a robust, multiprotocol linear ReDriver that offers a flexible interface while also meeting current and standby power requirements.
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New Chips January 21, 2020

Qualcomm Launches Three New Snapdragon Mobile Platforms for 4G Smartphones
The Qualcomm® Snapdragon™ 720G, 662 and 460, which will enable enhanced user experiences across connectivity, gaming and entertainment.
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New Chips January 21, 2020

Diodes Incorporated Announces Availability of Smallest Ultra-Thin Bus Switches
Diodes Incorporated announced that its family of quad- and dual-channel 4:1 and 2:1 bus switches are now available in an ultra-thin QFN (UQFN) package. The UQFN package makes it easier for OEMs to increase PCB density and reduce product dimensions when developing PC notebooks and tablets as well as networking and telecommunications equipment.
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New Chips January 21, 2020

Microchip announces Next Generation Miniature Atomic Clock Chip
Microchip releases MAC-SA5X, enhancing its Miniature Atomic Clock (MAC) technology to deliver wider temperature range and rapid warm-up time
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New Chips January 17, 2020

STMicroelectronics STM32 First SoC to Support LoRa® IoT Connections
STMicroelectronics has revealed the world’s first LoRa® system-on-chip (SoC) for connecting smart devices to the Internet of Things (IoT) using long-distance wireless connections.
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New Chips January 17, 2020

Broadcom Announces Family of Wi-Fi 6E Access Point Solutions for 6 GHz WLAN
Broadcom announced the availability of a portfolio of Wi-Fi 6E devices. Wi-Fi 6E is a new standard that builds on the rich feature set of Wi-Fi 6, including OFDMA and other multi-user operations that improve performance in crowded environments, advanced roaming capabilities and increased security. Wi-Fi 6E extends the Wi-Fi 6 standard to support the soon-to-be-operational 6 GHz band. This new band enables up to 1,200 MHz of spectrum for Wi-Fi use, which WLAN access point (AP) manufacturers can leverage to deliver faster speeds, higher capacity and lower latency with no congestion from legacy devices.
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New Chips January 17, 2020

Renesas Announces New PMIC for Automotive Cameras
The feature-rich 4-channel ISL78083 automotive camera PMIC includes a primary high-voltage synchronous buck regulator, two secondary low-voltage synchronous buck regulators, and a low-dropout (LDO) voltage regulator. With integrated feedback and integrated compensation, all that is left to complete the high efficiency power supply is the output inductor and capacitors.
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New Chips January 17, 2020

NXP Announces New i.MX 8M Processor with Integrated Neural Processing Unit
NXP Semiconductors today expanded its industry-leading EdgeVerse portfolio with the i.MX 8M Plus application processor – the first i.MX family to integrate a dedicated Neural Processing Unit (NPU) for advanced machine learning inference at the industrial and IoT (Internet-of-Things) edge.
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New Chips January 10, 2020

MediaTek Announces Dimensity 800 5G Series Chipsets for Premium 5G Smartphones
New chips bring flagship features and performance to midrange 5G smartphones
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New Chips January 10, 2020

Infineon Announces Smallest 3D Image Sensor for Face Authentication
IRS2877C chip will go into production in the middle of this year, along with an optimized illumination driver.
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New Chips January 9, 2020

New Maxim Chip Shrinks Power/Comm Footprint By Up To 80%
MAX20340 reduces form factor and cost while improving reliability by enabling simultaneous charging and communication over a single contact
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New Chips January 9, 2020

Maxim Automotive Display Power Management IC Shrinks Solution Size Up to 50%
MAX16923 4-output display power IC replaces up to five discrete ICs to support up to four displays in automobiles.
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New Chips January 9, 2020

Qualcomm Adds Dual-MAC Wi-Fi Chip to Automotive Portfolio
New QCA6595AU Chip Complements Company’s Wi-Fi 6 and Single MAC Products, Completes Qualcomm Portfolio of Scalable Wi-Fi and Bluetooth Products for Automotive Industry
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New Chips January 9, 2020

Diodes, Inc. Announces New Linear LED Driver
The BCR430UW6 Ultra-Low Dropout Linear LED Driver from Diodes Incorporated Extends Lighting Strips, for applications like signage illumination and architectural lighting.
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New Chips January 8, 2020

TI Introduces New Low Power Automotive Processor Platform
The first two automotive devices in the platform, TDA4VM processors for ADAS and DRA829V processors for gateway systems, include specialized on-chip accelerators to segment and expedite data-intensive tasks, like computer vision and deep learning.
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New Chips January 8, 2020

AMD Announces World’s Highest Performance Desktop & Ultrathin Laptop Processors
AMD announced the world’s first x86 8-core ultrathin laptop processors1 as part of the AMD Ryzen™ 4000 Series Mobile Processor family, and that the highly anticipated 64-core, 128-thread AMD Ryzen™ Threadripper™ 3990X will be available globally expected February 7, 2020.
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New Chips January 8, 2020

NXP Announces S32G Automotive Network Processors
The NXP S32 architecture addresses the challenges of future car development with a host of architectural innovations designed to allow carmakers to bring rich in-vehicle experiences and automated driving functions to market much faster than before.
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New Chips January 7, 2020

New Silicon Labs Secure Bluetooth SoC Supports Low Energy, Mesh Networking
Silicon Labs' new EFR32BG22 SoCs provide an optimized Bluetooth connectivity solution supporting the new Bluetooth 5.2 specification, Bluetooth direction finding and Bluetooth mesh.
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New Chips December 19, 2019

AMD Ryzen™ Embedded Processor Enables Ecosystem for High-Performance Mini PCs
AMD announced it is enabling an open ecosystem for OEMs to create and customize high performance Mini PCs, powered by AMD Ryzen™ Embedded V1000 and R1000 processors. ASRock Industrial, EEPD, OnLogic and Simply NUC, are the first OEMs to offer and sell these new Mini PC platforms for the industrial, media, communications and enterprise markets. These companies are giving customers an open and customizable platform based on high-performance CPU/GPU processor with expansive peripheral support, in-depth security features and a planned 10-year processor availability.
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New Chips December 19, 2019

Broadcom Ships Tomahawk 4, Highest Bandwidth Ethernet Switch Chip @ 25.6 Tbps
World’s First 64 x 400GbE / 256 x 100GbE Switching Silicon Enables Next Wave of Hyperscale Cloud Build-Out for Machine Learning and Storage Disaggregation. Broadcom announced that it has delivered the StrataXGS® Tomahawk® 4 switch series, demonstrating an unprecedented 25.6 Terabits/sec of Ethernet switching performance in a single device— double the bandwidth of any other switch silicon available in the market today.
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New Chips December 19, 2019

Allegro MicroSystems Has 1st Magnetic Gear Tooth Sensor IC for Traction Motors
Allegro MicroSystems announced the launch of the ATS17501, the industry’s first gear tooth sensor IC designed to provide incremental position for electric vehicle traction motors operating up to 30k RPM. The device addresses engineers’ most pressing traction motor challenges—including vibration at startup and running mode, high rotational speed, mechanical space constraints, high operating temperatures, and ISO 26262 safety requirements.
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New Chips December 18, 2019

Diodes, Inc. Announces 2 new DC-DC drivers for Auto LED Lamps
Diodes Incorporated today announced the AL8843Q and AL8862Q automotive-compliant DC-DC buck converters, designed for driving single LEDs and multiple LED strings in and around vehicles. Applications include daytime running lights (DRL), which many manufacturers now offer as standard, as well as fog lights, turn lights, and brake/stop lights.
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New Chips December 17, 2019

MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family
MediaTek's Dimensity 1000 5G integrated chip delivers unparalleled performance, ultra-fast speeds and seamless connectivity
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New Chips December 16, 2019

Renesas Announces World’s Smallest Photocouplers for Solar Inverter Applications
Renesas Electronics Corporation announced five new 8.2mm creepage photocouplers that are the world’s smallest isolation devices for industrial automation equipment and solar inverters. With a package width of 2.5mm, the RV1S92xxA and RV1S22xxA photocouplers reduce PCB mounting area by 35 percent compared to competitive couplers.
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New Chips December 16, 2019

ON Semi Announces New Family of Power Modules for Auto Traction Inverters
ON Semiconductor has released the first two devices from its new VE-Trac™ family of power modules for high voltage automotive traction inverters. On display at CES 2020, first devices on platforms from new VE-Trac™ family offer market-leading electrical and thermal performance.
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New Chips December 13, 2019

STMicroelectronics Launches Affordable and Easy-to-Use STM8 Nucleo-32 Boards
STMicroelectronics is making design starts using 8-bit STM8 microcontrollers (MCUs) faster, more affordable, and more accessible for creative minds of all types by introducing new development boards in the easy-to-use Nucleo-32 form factor .
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New Chips December 13, 2019

Intel Unveils New GPU  with High-Performance Computing, AI Acceleration
Intel Unveils New GPU Architecture with High-Performance Computing and AI Acceleration, and oneAPI Software Stack with Unified and Scalable Abstraction for Heterogeneous Architectures
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New Chips December 13, 2019

NXP Semiconductors announced the availability of its LPC552x/S2x Microcontroller (MCU) family – further extending its performance efficient LPC5500 MCU series with the second of seven families planned for the series.
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New Chips December 13, 2019

Microchip Unveils Details for RISC-V Enabled Low-Power PolarFire SoC FPGA Family
Early access program starts for PolarFire SoC, which delivers simultaneous support of real-time applications and rich operating systems with unparalleled power efficiency
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New Chips December 13, 2019

New Cypress ACG1F Controller Brings USB-C Performance and Versatility to Mainstream and Entry-Level Notebook and Desktop PCs
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New Chips December 13, 2019

Analog Devices Unveils Robust, Low-Latency PHY Technology
The ADIN1300 is a low-power, single port Ethernet transceiver with industry leading power and latency specifications primarily designed for time-critical industrial Ethernet applications up to Gigabit speeds.
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New Chips December 13, 2019

TI Announces New 4-channel Audio ADC
Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.
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